Package warpage challenges for LQFP 144 lead CMOS 90 device and it's impact to lead coplanarity

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746703 ◽

2010 ◽

Author(s):

Teng Seng Kiong ◽

Ibrahim Ruzaini ◽

Kesvakumar ◽

Foong Chee Seng

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