2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)
Latest Publications

TOTAL DOCUMENTS

113

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424488254

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A study on the effect of mold compound moisture related properties and leadframe dimension on the reliability of IC packages using an integrated mechanical modeling approach

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746691 ◽

2010 ◽

Cited By ~ 2

Author(s):

SK Chin ◽

Eric Erfe

Keyword(s):

Mechanical Modeling ◽

Modeling Approach

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A Proposed approach in applying optical character recognition for thermal image processing

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746767 ◽

2010 ◽

Author(s):

Chan Wai Ti ◽

Ir. Sim Kok Swee ◽

Tso Chih Ping

Keyword(s):

Image Processing ◽

Character Recognition ◽

Optical Character Recognition ◽

Thermal Image ◽

Optical Character ◽

Thermal Image Processing

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Plasma process considerations in emerging semiconductor packaging technologies

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746732 ◽

2010 ◽

Cited By ~ 2

Author(s):

James D. Getty ◽

Daniel Chir

Keyword(s):

Plasma Process ◽

Semiconductor Packaging

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Advanced finite element model on Copper wire ball bonding

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746692 ◽

2010 ◽

Cited By ~ 6

Author(s):

Hsiang-Chen Hsu ◽

Hong-Shen Chang ◽

Shu-Chi Tsao ◽

Shen-Li Fu

Keyword(s):

Finite Element ◽

Finite Element Model ◽

Copper Wire ◽

Element Model ◽

Ball Bonding

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Moisture induced corrosion in gold and copper ball bonds

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746748 ◽

2010 ◽

Cited By ~ 9

Author(s):

C. D. Breach ◽

Tee Wai Mun ◽

Teck Kheng Lee ◽

R. Holliday

Keyword(s):

Ball Bonds

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Package warpage challenges for LQFP 144 lead CMOS 90 device and it's impact to lead coplanarity

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746703 ◽

2010 ◽

Author(s):

Teng Seng Kiong ◽

Ibrahim Ruzaini ◽

Kesvakumar ◽

Foong Chee Seng

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Application of finite element analysis to reduce problem of ground ring delamination

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746690 ◽

2010 ◽

Author(s):

Foo Yeong Lee ◽

Chai Chee Meng ◽

Leong Kong Yang

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Element Analysis

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Metal line and via electromigration improvement with wafer level tests

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746673 ◽

2010 ◽

Author(s):

Ng Hong Seng ◽

Evie Kho Siaw Hei ◽

Raymond Tan

Keyword(s):

Wafer Level ◽

Metal Line

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Concurrent design for robust and cost efficient semiconductor manufacturing

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746717 ◽

2010 ◽

Author(s):

Foo Yeong Lee ◽

Lim Siew Lin ◽

Wang Mei Yong

Keyword(s):

Semiconductor Manufacturing ◽

Concurrent Design ◽

Cost Efficient

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Heterogeneous integration - A key enabling technology

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746757 ◽

2010 ◽

Cited By ~ 1

Author(s):

Rolf Aschenbrenner

Keyword(s):

Heterogeneous Integration ◽

Enabling Technology

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2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A study on the effect of mold compound moisture related properties and leadframe dimension on the reliability of IC packages using an integrated mechanical modeling approach

A Proposed approach in applying optical character recognition for thermal image processing

Plasma process considerations in emerging semiconductor packaging technologies

Advanced finite element model on Copper wire ball bonding

Moisture induced corrosion in gold and copper ball bonds

Package warpage challenges for LQFP 144 lead CMOS 90 device and it's impact to lead coplanarity

Application of finite element analysis to reduce problem of ground ring delamination

Metal line and via electromigration improvement with wafer level tests

Concurrent design for robust and cost efficient semiconductor manufacturing

Heterogeneous integration - A key enabling technology

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)
Latest Publications