2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)
Latest Publications

TOTAL DOCUMENTS

113

(FIVE YEARS 0)

H-INDEX

5

(FIVE YEARS 0)

Published By IEEE

9781424488254

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Application of finite element analysis to reduce problem of ground ring delamination

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746690 ◽

2010 ◽

Author(s):

Foo Yeong Lee ◽

Chai Chee Meng ◽

Leong Kong Yang

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Element Analysis

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Metal line and via electromigration improvement with wafer level tests

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746673 ◽

2010 ◽

Author(s):

Ng Hong Seng ◽

Evie Kho Siaw Hei ◽

Raymond Tan

Keyword(s):

Wafer Level ◽

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Advanced finite element model on Copper wire ball bonding

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746692 ◽

2010 ◽

Author(s):

Hsiang-Chen Hsu ◽

Hong-Shen Chang ◽

Shu-Chi Tsao ◽

Shen-Li Fu

Keyword(s):

Finite Element ◽

Finite Element Model ◽

Copper Wire ◽

Element Model ◽

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Moisture induced corrosion in gold and copper ball bonds

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746748 ◽

2010 ◽

Author(s):

C. D. Breach ◽

Tee Wai Mun ◽

Teck Kheng Lee ◽

R. Holliday

Keyword(s):

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Package warpage challenges for LQFP 144 lead CMOS 90 device and it's impact to lead coplanarity

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746703 ◽

2010 ◽

Author(s):

Teng Seng Kiong ◽

Ibrahim Ruzaini ◽

Kesvakumar ◽

Foong Chee Seng

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A study on the effect of mold compound moisture related properties and leadframe dimension on the reliability of IC packages using an integrated mechanical modeling approach

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746691 ◽

2010 ◽

Author(s):

SK Chin ◽

Eric Erfe

Keyword(s):

Mechanical Modeling ◽

Modeling Approach

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A Proposed approach in applying optical character recognition for thermal image processing

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746767 ◽

2010 ◽

Author(s):

Chan Wai Ti ◽

Ir. Sim Kok Swee ◽

Tso Chih Ping

Keyword(s):

Image Processing ◽

Character Recognition ◽

Optical Character Recognition ◽

Thermal Image ◽

Optical Character ◽

Thermal Image Processing

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Plasma process considerations in emerging semiconductor packaging technologies

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746732 ◽

2010 ◽

Author(s):

James D. Getty ◽

Daniel Chir

Keyword(s):

Plasma Process ◽

Semiconductor Packaging

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Challenges in copper 2nd bond quality on nickel palladium leadframe

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746750 ◽

2010 ◽

Author(s):

Tan Kian Heong ◽

Fuaida Harun

Keyword(s):

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Fabrication of silica/epoxy thin film composite for electronic packaging application

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) ◽

10.1109/iemt.2010.5746733 ◽

2010 ◽

Author(s):

Y.L.E. Foo ◽

M. Mariatti ◽

A. Azizan ◽

L.C. Sim

Keyword(s):

Thin Film ◽

Electronic Packaging ◽

Film Composite ◽

Thin Film Composite

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