Thick Palladium Coated Copper (PCC) Wire BSOB Bonding on a Pre-Plated Frame Chip on Lead Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511659 ◽

2018 ◽

Author(s):

Jose Palagud ◽

S.W. Wang

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