2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781538662113

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Co-relationship of the Die Attach Machine Dynamic Impact Force Trend with Cracked Die Occurrences for Shrink Chip Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511778 ◽

2018 ◽

Author(s):

Yue Hang Tan ◽

Wai Shan Liau

Keyword(s):

Impact Force ◽

Dynamic Impact ◽

Die Attach ◽

Relationship Of

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75um Al Thin Wire Lifted Wedge Solutions on Hanging Centre Lead in DPak

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511750 ◽

2018 ◽

Author(s):

Jocson Emil Lamco ◽

Bajuri Mohd Kahar ◽

Wai Chee Mun

Keyword(s):

Thin Wire

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Package Defect Test System and Its Application in Assembly Improvement

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511661 ◽

2018 ◽

Author(s):

Shaari Ripin ◽

M Mamunur Rashid Mohd Firdaus ◽

Gopi Nathan Sathia ◽

Xue Ming

Keyword(s):

Test System

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Thick Palladium Coated Copper (PCC) Wire BSOB Bonding on a Pre-Plated Frame Chip on Lead Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511659 ◽

2018 ◽

Author(s):

Jose Palagud ◽

S.W. Wang

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Single Stitch Low Loop Capability and Optimization on Al 500um Wire for Top Side Cooling Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511690 ◽

2018 ◽

Author(s):

Zakaria Abdullah ◽

VillamorRamos Macaric

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New Benchmarked Standard in Yield and OEE Improvement - SENS PSSO STS Gen2 Taper Performance Improvement with Breakthrough Innovative Solutions

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511730 ◽

2018 ◽

Cited By ~ 1

Author(s):

Lim Khai Herng ◽

Queck Cham Hee

Keyword(s):

Performance Improvement ◽

Innovative Solutions

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Investigation on Solder Void Formation Mechanism After High Temperatures Stress by 3D CT Scan and EDX Analysis

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511764 ◽

2018 ◽

Author(s):

Lai Chin Yung ◽

Ho Ing Hong ◽

Eric Wong Soon Kiong ◽

Cheong Choke Fei

Keyword(s):

Ct Scan ◽

High Temperatures ◽

Formation Mechanism ◽

Void Formation ◽

3D Ct ◽

Edx Analysis ◽

3D Ct Scan

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Challenges to Improve Packages Robustness and Elimination of Mold Compound Sticking on Power Leaded Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511770 ◽

2018 ◽

Author(s):

Mei Qi Tay ◽

Yun Zhao ◽

Ming Siong Lim ◽

Raymond Kim Swee Goh

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Influence of Copper Plating Current Density Toward Voids Formation at High Temperature Storage (HTS) Test

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511675 ◽

2018 ◽

Author(s):

Ronizan bin Mohd Salleh

Keyword(s):

High Temperature ◽

Current Density ◽

Copper Plating ◽

High Temperature Storage ◽

Temperature Storage

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Vacuum Reflow Process Characterization for Void-Less Soldering Process in Semiconductor Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511767 ◽

2018 ◽

Author(s):

Siang Miang Yeo ◽

Azman Mahmood ◽

Shahrul Haizal Ishak

Keyword(s):

Reflow Process ◽

Soldering Process ◽

Process Characterization

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2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Co-relationship of the Die Attach Machine Dynamic Impact Force Trend with Cracked Die Occurrences for Shrink Chip Package

75um Al Thin Wire Lifted Wedge Solutions on Hanging Centre Lead in DPak

Package Defect Test System and Its Application in Assembly Improvement

Thick Palladium Coated Copper (PCC) Wire BSOB Bonding on a Pre-Plated Frame Chip on Lead Package

Single Stitch Low Loop Capability and Optimization on Al 500um Wire for Top Side Cooling Package

New Benchmarked Standard in Yield and OEE Improvement - SENS PSSO STS Gen2 Taper Performance Improvement with Breakthrough Innovative Solutions

Investigation on Solder Void Formation Mechanism After High Temperatures Stress by 3D CT Scan and EDX Analysis

Challenges to Improve Packages Robustness and Elimination of Mold Compound Sticking on Power Leaded Package

Influence of Copper Plating Current Density Toward Voids Formation at High Temperature Storage (HTS) Test

Vacuum Reflow Process Characterization for Void-Less Soldering Process in Semiconductor Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)
Latest Publications