2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)
Latest Publications

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Published By IEEE

9781538662113

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Co-relationship of the Die Attach Machine Dynamic Impact Force Trend with Cracked Die Occurrences for Shrink Chip Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511778 ◽

2018 ◽

Author(s):

Yue Hang Tan ◽

Wai Shan Liau

Keyword(s):

Impact Force ◽

Dynamic Impact ◽

Die Attach ◽

Relationship Of

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75um Al Thin Wire Lifted Wedge Solutions on Hanging Centre Lead in DPak

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511750 ◽

2018 ◽

Author(s):

Jocson Emil Lamco ◽

Bajuri Mohd Kahar ◽

Wai Chee Mun

Keyword(s):

Thin Wire

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Single Stitch Low Loop Capability and Optimization on Al 500um Wire for Top Side Cooling Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511690 ◽

2018 ◽

Author(s):

Zakaria Abdullah ◽

VillamorRamos Macaric

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Package Defect Test System and Its Application in Assembly Improvement

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511661 ◽

2018 ◽

Author(s):

Shaari Ripin ◽

M Mamunur Rashid Mohd Firdaus ◽

Gopi Nathan Sathia ◽

Xue Ming

Keyword(s):

Test System

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Thick Palladium Coated Copper (PCC) Wire BSOB Bonding on a Pre-Plated Frame Chip on Lead Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511659 ◽

2018 ◽

Author(s):

Jose Palagud ◽

S.W. Wang

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Challenges to Improve Packages Robustness and Elimination of Mold Compound Sticking on Power Leaded Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511770 ◽

2018 ◽

Author(s):

Mei Qi Tay ◽

Yun Zhao ◽

Ming Siong Lim ◽

Raymond Kim Swee Goh

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Influence of Copper Plating Current Density Toward Voids Formation at High Temperature Storage (HTS) Test

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511675 ◽

2018 ◽

Author(s):

Ronizan bin Mohd Salleh

Keyword(s):

High Temperature ◽

Current Density ◽

Copper Plating ◽

High Temperature Storage ◽

Temperature Storage

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Vacuum Reflow Process Characterization for Void-Less Soldering Process in Semiconductor Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511767 ◽

2018 ◽

Author(s):

Siang Miang Yeo ◽

Azman Mahmood ◽

Shahrul Haizal Ishak

Keyword(s):

Reflow Process ◽

Soldering Process ◽

Process Characterization

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Die Pop Challenge and Comprehensive Solutions in Vacuum Reflow Technology for Semiconductor Packaging

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511624 ◽

2018 ◽

Author(s):

Siang Miang Yeo ◽

Azman Mahmood ◽

Nur Afifah Md Yazid

Keyword(s):

Semiconductor Packaging

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Challenges in Singulation Process of Corner Lead with Wet-Able Pocket on Thin QFN Packages

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511714 ◽

2018 ◽

Author(s):

Noorazam Bin Azman ◽

Mohd Akif Emir A. Aziz

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2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Co-relationship of the Die Attach Machine Dynamic Impact Force Trend with Cracked Die Occurrences for Shrink Chip Package

75um Al Thin Wire Lifted Wedge Solutions on Hanging Centre Lead in DPak

Single Stitch Low Loop Capability and Optimization on Al 500um Wire for Top Side Cooling Package

Package Defect Test System and Its Application in Assembly Improvement

Thick Palladium Coated Copper (PCC) Wire BSOB Bonding on a Pre-Plated Frame Chip on Lead Package

Challenges to Improve Packages Robustness and Elimination of Mold Compound Sticking on Power Leaded Package

Influence of Copper Plating Current Density Toward Voids Formation at High Temperature Storage (HTS) Test

Vacuum Reflow Process Characterization for Void-Less Soldering Process in Semiconductor Package

Die Pop Challenge and Comprehensive Solutions in Vacuum Reflow Technology for Semiconductor Packaging

Challenges in Singulation Process of Corner Lead with Wet-Able Pocket on Thin QFN Packages

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)
Latest Publications