Challenges in Singulation Process of Corner Lead with Wet-Able Pocket on Thin QFN Packages

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511714 ◽

2018 ◽

Author(s):

Noorazam Bin Azman ◽

Mohd Akif Emir A. Aziz

Download Full-text