Challenges to Improve Packages Robustness and Elimination of Mold Compound Sticking on Power Leaded Package

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2018.8511770 ◽

2018 ◽

Author(s):

Mei Qi Tay ◽

Yun Zhao ◽

Ming Siong Lim ◽

Raymond Kim Swee Goh

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