Post porosity plasma protection integration at 48 nm pitch

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) ◽

10.1109/iitc-amc.2016.7507715 ◽

2016 ◽

Author(s):

Huai Huang ◽

Krystelle Lionti ◽

Willi Volksen ◽

Terry Spooner ◽

Hosadurga Shobha ◽

...

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