2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
Latest Publications

TOTAL DOCUMENTS

85

(FIVE YEARS 0)

H-INDEX

7

(FIVE YEARS 0)

Published By IEEE

9781509003860

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Impact of across-wafer variation on the electrical performance of TSVs

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) ◽

10.1109/iitc-amc.2016.7507707 ◽

2016 ◽

Author(s):

L. Filipovic ◽

S. Selberherr ◽

A. P. Singulani ◽

F. Roger ◽

S. Carniello

Keyword(s):

Electrical Performance

Download Full-text

Post porosity plasma protection integration at 48 nm pitch

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) ◽

10.1109/iitc-amc.2016.7507715 ◽

2016 ◽

Author(s):

Huai Huang ◽

Krystelle Lionti ◽

Willi Volksen ◽

Terry Spooner ◽

Hosadurga Shobha ◽

...

Download Full-text

Performance analyses and benchmarking for spintronic devices and interconnects

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) ◽

10.1109/iitc-amc.2016.7507679 ◽

2016 ◽

Author(s):

Chenyun Pan ◽

Sou-Chi Chang ◽

Azad Naeemi

Keyword(s):

Spintronic Devices ◽

Performance Analyses

Download Full-text

Technology and design architectures and process innovations for 7 and 5nm BEOL interconnects

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) ◽

10.1109/iitc-amc.2016.7507640 ◽

2016 ◽

Author(s):

Larry Clevenger

Keyword(s):

Process Innovations ◽

Technology And Design

Download Full-text

Characterization of Advanced Sequential Flow Deposition (ASFD) TiON electrode in MIM structure for leakage current reduction

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) ◽

10.1109/iitc-amc.2016.7507724 ◽

2016 ◽

Author(s):

Tadahiro Ishizaka ◽

Masaki Koizumi ◽

Masaki Sano ◽

Seokhyoung Hong ◽

Masato Koizumi ◽

...

Keyword(s):

Leakage Current ◽

Current Reduction

Download Full-text

Semi consolidation in an age of Moore anxiety

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) ◽

10.1109/iitc-amc.2016.7507635 ◽

2016 ◽

Author(s):

Joe Sawicki

Download Full-text

Interconnect roles for emerging memory technologies in 3D architecture

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) ◽

10.1109/iitc-amc.2016.7507687 ◽

2016 ◽

Author(s):

Er-Xuan Ping

Keyword(s):

Emerging Memory ◽

3D Architecture

Download Full-text

Contact resistance and reliability of 40 nm carbon nanotube vias

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) ◽

10.1109/iitc-amc.2016.7507732 ◽

2016 ◽

Author(s):

Anshul A. Vyas ◽

Cary Y. Yang ◽

Phillip Wang ◽

Changjian Zhou ◽

Yang Chai

Keyword(s):

Carbon Nanotube ◽

Contact Resistance

Download Full-text

Spin-based interconnect technology and design

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) ◽

10.1109/iitc-amc.2016.7507735 ◽

2016 ◽

Author(s):

Azad Naeemi ◽

Sou-Chi Chang ◽

Sourav Dutta ◽

Chenyun Pan ◽

Sasikanth Manipatruni ◽

...

Keyword(s):

Interconnect Technology ◽

Technology And Design

Download Full-text

Toward successful integration of gap-filling ultralow-k dielectrics

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) ◽

10.1109/iitc-amc.2016.7507645 ◽

2016 ◽

Author(s):

L. Zhang ◽

J.-F. de Marneffe ◽

A. Lesniewska ◽

P. Verdonck ◽

N. Heylen ◽

...

Keyword(s):

Gap Filling ◽

Successful Integration

Download Full-text