Modeling Wafer Bending Effects on RDL Layer Reliability in a Multiple Die Package

2018 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc.2018.8430421 ◽

2018 ◽

Author(s):

Tzu Chen Wang ◽

Chih Chieh Yeh ◽

Xiaopeng Xu ◽

Karim EI Sayed ◽

Chun-Hung Steven Lin

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