2018 IEEE International Interconnect Technology Conference (IITC)
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68
(FIVE YEARS 0)

H-INDEX

5
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Published By IEEE

9781538643372
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Modeling Wafer Bending Effects on RDL Layer Reliability in a Multiple Die Package

2018 ◽  
Author(s):  
Tzu Chen Wang ◽  
Chih Chieh Yeh ◽  
Xiaopeng Xu ◽  
Karim EI Sayed ◽  
Chun-Hung Steven Lin

Stress Induced Densification of Thin Porous Low-K Films During Nanoindentation

2018 ◽  
Author(s):  
O. O. Okudur ◽  
M. Rcdzheb ◽  
K. Vanstreels ◽  
H. Zahcdnamesh ◽  
M. Gonzalez ◽  
...  
Keyword(s):  
Low K

Silicide Based Low Temperature and Low Pressure Bonding of TI/SI for Microfludic and Hermetic Selaling Application

2018 ◽  
Author(s):  
C Hemanth Kumar ◽  
Asisa Kumar Pnaigrahi ◽  
Nirupam Paul ◽  
Satish Bonam ◽  
Siva Rama Krishna Vanjari ◽  
...  
Keyword(s):  
Low Temperature ◽  
Low Pressure

PVD- Treated ALD TaN for Cu Interconnect Extension to 5nm Node and Beyond

2018 ◽  
Author(s):  
Zhiyuan Wu ◽  
Rui Li ◽  
Xiangjin Xie ◽  
Wesley Suen ◽  
Jennifer Tseng ◽  
...  
Keyword(s):  
Cu Interconnect

From Direct Bonding Mechanism to 3D Applications

2018 ◽  
Author(s):  
F. Fournel ◽  
H. Moriceau ◽  
V. Larrey ◽  
C. Morales ◽  
C. Mauguen ◽  
...  
Keyword(s):  
Bonding Mechanism ◽  
3D Applications
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