2018 IEEE International Interconnect Technology Conference (IITC)
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68
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5
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Published By IEEE

9781538643372
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Modeling Wafer Bending Effects on RDL Layer Reliability in a Multiple Die Package

2018 ◽  
Author(s):  
Tzu Chen Wang ◽  
Chih Chieh Yeh ◽  
Xiaopeng Xu ◽  
Karim EI Sayed ◽  
Chun-Hung Steven Lin

Stress Induced Densification of Thin Porous Low-K Films During Nanoindentation

2018 ◽  
Author(s):  
O. O. Okudur ◽  
M. Rcdzheb ◽  
K. Vanstreels ◽  
H. Zahcdnamesh ◽  
M. Gonzalez ◽  
...  
Keyword(s):  
Low K

Silicide Based Low Temperature and Low Pressure Bonding of TI/SI for Microfludic and Hermetic Selaling Application

2018 ◽  
Author(s):  
C Hemanth Kumar ◽  
Asisa Kumar Pnaigrahi ◽  
Nirupam Paul ◽  
Satish Bonam ◽  
Siva Rama Krishna Vanjari ◽  
...  
Keyword(s):  
Low Temperature ◽  
Low Pressure

Replacement Metal Contact Using Sacrificial ILD0 for Wrap Around Contact in Scaled FinFET Technology

2018 ◽  
Author(s):  
S-A. Chew ◽  
S. Demuynck ◽  
L. Zhang ◽  
A. Pacco ◽  
K. Devriendt ◽  
...  
Keyword(s):  
Metal Contact

Modulation of Within-Wafer and Within-die Topography for Damascene Copper in Advanced Technology

2018 ◽  
Author(s):  
Wei-Tsu Tseng ◽  
Tien-Jen Cheng ◽  
Shafaat Ahmed ◽  
Jusang Lee ◽  
Frieder Baumann
Keyword(s):  
Advanced Technology

Silicon Trench Etch Uniformity Improvement for Microloading and Macro-to-Macro Loading for sub-14nmNode

2018 ◽  
Author(s):  
Yong Mo Yang ◽  
Sang Woo Lim ◽  
Junsic Hong ◽  
Mira Park ◽  
Yinxiao Yang ◽  
...  

PVD- Treated ALD TaN for Cu Interconnect Extension to 5nm Node and Beyond

2018 ◽  
Author(s):  
Zhiyuan Wu ◽  
Rui Li ◽  
Xiangjin Xie ◽  
Wesley Suen ◽  
Jennifer Tseng ◽  
...  
Keyword(s):  
Cu Interconnect

Tungsten Plug Missing Defects Monitoring Method and Its Solution by Optimization of Polymer Cleaning and Micro-environment

2018 ◽  
Author(s):  
Rongwei Fan ◽  
Hunglin Chen ◽  
Kai Wang ◽  
Yin Long ◽  
Qiliang Ni
Keyword(s):  
Monitoring Method
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