Silicon Trench Etch Uniformity Improvement for Microloading and Macro-to-Macro Loading for sub-14nmNode

2018 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc.2018.8430443 ◽

2018 ◽

Author(s):

Yong Mo Yang ◽

Sang Woo Lim ◽

Junsic Hong ◽

Mira Park ◽

Yinxiao Yang ◽

...

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