Case studied of failure threat caused by counterfeit plastic encapsulated microcircuits

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2013.6599226 ◽

2013 ◽

Author(s):

Y.L Wang ◽

XJ Kuang ◽

CM Huang ◽

S.P Li

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