Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications

TOTAL DOCUMENTS

159

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781479904808, 9781479912414

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Eliminating the top causes of customer-attributable integrated circuit failures

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2013.6599118 ◽

2013 ◽

Author(s):

Andrew H. Olney

Keyword(s):

Integrated Circuit

Download Full-text

Case studied of failure threat caused by counterfeit plastic encapsulated microcircuits

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2013.6599226 ◽

2013 ◽

Cited By ~ 1

Author(s):

Y.L Wang ◽

XJ Kuang ◽

CM Huang ◽

S.P Li

Download Full-text

Ultra high precision circuit diagnosis through seebeck generation and charge monitoring

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2013.6599119 ◽

2013 ◽

Cited By ~ 2

Author(s):

Christian Boit ◽

Clemens Helfmeier ◽

Dmitry Nedospasov ◽

Alexander Fox

Keyword(s):

High Precision

Download Full-text

Successful failure analysis using fault diagnosis tool and product characterization board in BiCMOS technology low yield investigation

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2013.6599238 ◽

2013 ◽

Author(s):

Renee Liu ◽

Aaron Chin ◽

Seah Pei Hong ◽

Lee Wenfeng

Keyword(s):

Fault Diagnosis ◽

Failure Analysis ◽

Product Characterization ◽

Bicmos Technology ◽

Diagnosis Tool

Download Full-text

Bias dependence of dose rate effects in the irradiated substrate PNP transistors

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2013.6599264 ◽

2013 ◽

Author(s):

Yuan Liu ◽

Qian Shi ◽

Ting Zhang ◽

Yun-Fei En ◽

Bin Li ◽

...

Keyword(s):

Dose Rate ◽

Dose Rate Effects ◽

Rate Effects

Download Full-text

Thermal effect on die warpage during back-side die polishing of flip-chip BGA device

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2013.6599195 ◽

2013 ◽

Author(s):

M. Mezanur Rahman Monjur ◽

M.S. Wei ◽

H.B. Chong ◽

L Nasar-Abdat ◽

Vinod Narang

Keyword(s):

Thermal Effect ◽

Flip Chip ◽

Back Side

Download Full-text

SCM application in localized 2D dopant profiling

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2013.6599236 ◽

2013 ◽

Author(s):

Lee Siew Shyuan ◽

Kenny Gan Chye Siong ◽

Lee Nean Sern

Keyword(s):

Dopant Profiling

Download Full-text

New capability of laser ablation in failure analysis

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2013.6599221 ◽

2013 ◽

Author(s):

C.N. Liew ◽

K.L. Khoo ◽

L.S. Tiang ◽

Y.J. Ng

Keyword(s):

Laser Ablation ◽

Failure Analysis

Download Full-text

The evaluation of quality and reliability management system in the foundry process

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2013.6599273 ◽

2013 ◽

Author(s):

Zhang XiaoWen ◽

En yunfei

Keyword(s):

Management System ◽

Reliability Management ◽

Quality And Reliability

Download Full-text

Backside dynamic thermal laser signal injection microscopy (T-LSIM) fault isolation technique on WLCSP devices

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2013.6599213 ◽

2013 ◽

Cited By ~ 1

Author(s):

ZJ. Lau ◽

H.P. Chan

Keyword(s):

Fault Isolation ◽

Isolation Technique ◽

Laser Signal ◽

Signal Injection

Download Full-text

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Eliminating the top causes of customer-attributable integrated circuit failures

Case studied of failure threat caused by counterfeit plastic encapsulated microcircuits

Ultra high precision circuit diagnosis through seebeck generation and charge monitoring

Successful failure analysis using fault diagnosis tool and product characterization board in BiCMOS technology low yield investigation

Bias dependence of dose rate effects in the irradiated substrate PNP transistors

Thermal effect on die warpage during back-side die polishing of flip-chip BGA device

SCM application in localized 2D dopant profiling

New capability of laser ablation in failure analysis

The evaluation of quality and reliability management system in the foundry process

Backside dynamic thermal laser signal injection microscopy (T-LSIM) fault isolation technique on WLCSP devices

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications