A novel stacking method of filling hole used in package on package

2013 IEEE International Symposium on Advanced Packaging Materials ◽

10.1109/isapm.2013.6510391 ◽

2013 ◽

Author(s):

Ling-Feng Shi ◽

Zheng Wei ◽

Xin-Quan Lai ◽

Qin-Qin Li ◽

Chen Liu

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