2013 IEEE International Symposium on Advanced Packaging Materials
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9781467360920, 9781467360937, 9781467360913
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Newly developed ultralow CTE materials for thinner PKG applications

2013 ◽  
Author(s):  
K. Oohashi ◽  
M. Miyatake ◽  
H. Murai ◽  
S. Takanezawa ◽  
S. Tsuchikawa ◽  
...  

A novel type of stacked package and assembling method on the SOC

2013 ◽  
Author(s):  
Ling-Feng Shi ◽  
Hong-Feng Jiang ◽  
Xin-Quan Lai ◽  
Li-Ye Cheng ◽  
Cong Liu

A novel stacking method of filling hole used in package on package

2013 ◽  
Author(s):  
Ling-Feng Shi ◽  
Zheng Wei ◽  
Xin-Quan Lai ◽  
Qin-Qin Li ◽  
Chen Liu
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