FOUP cleaning - FOSB transportation: a challenge for manufacturing on 300 mm wafers

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) ◽

10.1109/issm.2001.963022 ◽

2002 ◽

Author(s):

J. Frickinger ◽

J. Bugler ◽

G. Zielonka ◽

H. Ryssel ◽

M. Hans Dudenhausen ◽

...

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