Effect of texture on the electromigration of CVD copper

1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual ◽

10.1109/relphy.1997.584260 ◽

2002 ◽

Author(s):

Changsup Ryu ◽

A.L.S. Loke ◽

T. Nogami ◽

S.S. Wong

Download Full-text