Consistent Modeling of Snapback Phenomenon Based on Conventional I-V Measurements

2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) ◽

10.1109/sispad.2018.8551702 ◽

2018 ◽

Author(s):

Takahiro Iizuka ◽

Mitiko Miura-Mattausch ◽

Hiroyuki Hashigami ◽

Hans Jurgen Mattausch

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