TSV technology and challenges for 3D stacked DRAM

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ◽

10.1109/vlsit.2014.6894397 ◽

2014 ◽

Author(s):

Chang Yeol Lee ◽

Sungchul Kim ◽

Hongshin Jun ◽

Kyung Whan Kim ◽

Sung Joo Hong

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