2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers
Latest Publications

TOTAL DOCUMENTS

102

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Published By IEEE

9781479933327, 9781479933310, 9781479933303

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A highly scalable STT-MRAM fabricated by a novel technique for shrinking a magnetic tunnel junction with reducing processing damage

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ◽

10.1109/vlsit.2014.6894365 ◽

2014 ◽

Cited By ~ 4

Author(s):

Y. Iba ◽

A. Takahashi ◽

A. Hatada ◽

M. Nakabayashi ◽

C. Yoshida ◽

...

Keyword(s):

Tunnel Junction ◽

Magnetic Tunnel Junction ◽

Novel Technique

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A novel metallic complex reaction etching for transition metal and magnetic material by low-temperature and damage-free neutral beam process for non-volatile MRAM device applications

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ◽

10.1109/vlsit.2014.6894362 ◽

2014 ◽

Cited By ~ 1

Author(s):

Xun Gu ◽

Yoshiyuki Kikuchi ◽

Toshihisa Nozawa ◽

Seiji Samukawa

Keyword(s):

Magnetic Material ◽

Low Temperature ◽

Transition Metal ◽

Neutral Beam ◽

Complex Reaction ◽

Device Applications ◽

Metallic Complex

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TSV technology and challenges for 3D stacked DRAM

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ◽

10.1109/vlsit.2014.6894397 ◽

2014 ◽

Author(s):

Chang Yeol Lee ◽

Sungchul Kim ◽

Hongshin Jun ◽

Kyung Whan Kim ◽

Sung Joo Hong

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Thermally robust CMOS-aware Ge MOSFETs with high mobility at high-carrier densities on a single orientation Ge substrate

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ◽

10.1109/vlsit.2014.6894394 ◽

2014 ◽

Cited By ~ 11

Author(s):

C. H. Lee ◽

C. Lu ◽

T. Nishimura ◽

K. Nagashio ◽

A. Toriumi

Keyword(s):

High Mobility ◽

High Carrier ◽

Single Orientation

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Applying a redundancy scheme to address post-assembly yield loss in 3D FPGAs

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ◽

10.1109/vlsit.2014.6894396 ◽

2014 ◽

Cited By ~ 3

Author(s):

Rafael C Camarota ◽

Jennifer Wong ◽

Henley Liu ◽

Pat McGuire

Keyword(s):

Yield Loss

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Tailoring switching and endurance / retention reliability characteristics of HfO2 / Hf RRAM with Ti, Al, Si dopants

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ◽

10.1109/vlsit.2014.6894403 ◽

2014 ◽

Cited By ~ 6

Author(s):

Y. Y. Chen ◽

R. Roelofs ◽

A. Redolfi ◽

R. Degraeve ◽

D. Crotti ◽

...

Keyword(s):

Reliability Characteristics

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Group IV channels for 7nm FinFETs: Performance for SoCs power and speed metrics

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ◽

10.1109/vlsit.2014.6894380 ◽

2014 ◽

Cited By ~ 3

Author(s):

M. Garcia Bardon ◽

P. Raghavan ◽

G. Eneman ◽

P. Schuddinck ◽

M. Dehan ◽

...

Keyword(s):

Group Iv

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A 10nm platform technology for low power and high performance application featuring FINFET devices with multi workfunction gate stack on bulk and SOI

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ◽

10.1109/vlsit.2014.6894342 ◽

2014 ◽

Cited By ~ 21

Author(s):

K. -I. Seo ◽

B. Haran ◽

D. Gupta ◽

D. Guo ◽

T. Standaert ◽

...

Keyword(s):

Low Power ◽

High Performance ◽

Gate Stack ◽

Platform Technology ◽

High Performance Application

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A fast and low-voltage Cu complementary-atom-switch 1Mb array with high-temperature retention

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ◽

10.1109/vlsit.2014.6894437 ◽

2014 ◽

Cited By ~ 4

Author(s):

N. Banno ◽

M. Tada ◽

T. Sakamoto ◽

M. Miyamura ◽

K. Okamoto ◽

...

Keyword(s):

High Temperature ◽

Low Voltage

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Low-loss silicon interposer for three-dimensional system integration with embedded microfluidic cooling

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ◽

10.1109/vlsit.2014.6894399 ◽

2014 ◽

Cited By ~ 4

Author(s):

Paragkumar A. Thadesar ◽

Li Zheng ◽

Muhannad S. Bakir

Keyword(s):

System Integration ◽

Three Dimensional ◽

Dimensional System ◽

Low Loss ◽

Three Dimensional System

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2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical PapersLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A highly scalable STT-MRAM fabricated by a novel technique for shrinking a magnetic tunnel junction with reducing processing damage

A novel metallic complex reaction etching for transition metal and magnetic material by low-temperature and damage-free neutral beam process for non-volatile MRAM device applications

TSV technology and challenges for 3D stacked DRAM

Thermally robust CMOS-aware Ge MOSFETs with high mobility at high-carrier densities on a single orientation Ge substrate

Applying a redundancy scheme to address post-assembly yield loss in 3D FPGAs

Tailoring switching and endurance / retention reliability characteristics of HfO2 / Hf RRAM with Ti, Al, Si dopants

Group IV channels for 7nm FinFETs: Performance for SoCs power and speed metrics

A 10nm platform technology for low power and high performance application featuring FINFET devices with multi workfunction gate stack on bulk and SOI

A fast and low-voltage Cu complementary-atom-switch 1Mb array with high-temperature retention

Low-loss silicon interposer for three-dimensional system integration with embedded microfluidic cooling

2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers
Latest Publications