Electromigration improvements with titanium underlay and overlay in Al(Cu) metallurgy

1991 Proceedings Eighth International IEEE VLSI Multilevel Interconnection Conference ◽

10.1109/vmic.1991.152994 ◽

2002 ◽

Author(s):

J.J. Estabil ◽

H.S. Rathore ◽

E.N. Levine

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