E-19 EFFECT OF MATERIAL THICKNESS ON THE SINGULAR STRESS FIELD IN ELASTIC-CREEP BI-MATERIAL INTERFACE(Session: Contact strength/Mechanical)

2006 ◽  
Vol 2006 (0) ◽  
pp. 111
Author(s):  
Kittikorn Ngampungpis ◽  
Hiroyuki Hirakata ◽  
Takayuki Kitamura
Keyword(s):  
Stress Field ◽  
Contact Strength ◽  
Singular Stress ◽  
Material Interface ◽  
Material Thickness ◽  
Singular Stress Field

scholarly journals Effect of Material Thickness on the Singular Stress Field in Elastic-creep Bi-material Interface

2007 ◽  
Vol 1 (6) ◽  
pp. 744-754 ◽  
Author(s):  
Kittikorn NGAMPUNGPIS ◽  
Takayuki KITAMURA ◽  
Hiroyuki HIRAKATA
Keyword(s):  
Stress Field ◽  
Singular Stress ◽  
Material Interface ◽  
Material Thickness ◽  
Singular Stress Field

scholarly journals 219 singular stress-field and crack opening displacement of interface crack

2001 ◽  
Vol 2001.54 (0) ◽  
pp. 71-72
Author(s):  
Atsushi OHTA ◽  
Yasufumi IMAI ◽  
Akihide SAIMOTO ◽  
Fumitaka MOTOMURA
Keyword(s):  
Stress Field ◽  
Crack Opening Displacement ◽  
Interface Crack ◽  
Crack Opening ◽  
Singular Stress ◽  
Opening Displacement ◽  
Singular Stress Field

Fracture toughness of silicon in nanometer-scale singular stress field

2015 ◽  
Vol 150 ◽  
pp. 161-167 ◽  
Author(s):  
Takashi Sumigawa ◽  
Shinsaku Ashida ◽  
Shuhei Tanaka ◽  
Kazunori Sanada ◽  
Takayuki Kitamura
Keyword(s):  
Fracture Toughness ◽  
Stress Field ◽  
Nanometer Scale ◽  
Singular Stress ◽  
Singular Stress Field

Analysis of Intensity of Singular Stress Field at the Stepped-Lap Joint

2021 ◽  
Author(s):  
Nao-aki Noda ◽  
Biao Wang ◽  
Sirui Wang ◽  
Rei Takaki ◽  
Yoshikazu Sano
Keyword(s):  
Stress Field ◽  
Lap Joint ◽  
Singular Stress ◽  
Singular Stress Field
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