scholarly journals 219 singular stress-field and crack opening displacement of interface crack

2001 ◽  
Vol 2001.54 (0) ◽  
pp. 71-72
Author(s):  
Atsushi OHTA ◽  
Yasufumi IMAI ◽  
Akihide SAIMOTO ◽  
Fumitaka MOTOMURA
2005 ◽  
Vol 40 (4) ◽  
pp. 327-344 ◽  
Author(s):  
M Ravichandran ◽  
K Ramesh

Photoelastic evaluation of the stress intensity factor (SIF) for a crack in a bimaterial tangential to the interface is hitherto confined to the use of only a singular stress field equation. In this paper, the multi-parameter stress field equations of Deng are simplified for use by experimentalists to evaluate the stress field parameters by digital photoelasticity using an overdeterministic least-squares technique. A bimaterial Brazillian disc with a central interface crack is selected as the model for study as different mode mixities could be easily simulated by changing the crack orientation angle. The use of SIF evaluation based on a singular stress field equation is found to be inadequate for the problems considered. On the other hand, the use of a multi-parameter stress field equation is quite successful in evaluating the stress field for various mode mixities and for two values of bimaterial constant. It is shown that the new procedure allows data collection from a larger zone, which helps to simplify data collection from experiments.


2015 ◽  
Vol 2015 (0) ◽  
pp. _OS0509-31-_OS0509-31
Author(s):  
Kazuhiro ODA ◽  
Takuya NISHIMURA ◽  
Yuki SUGITA ◽  
Yosuke TAKAHATA ◽  
Noriko TSUTSUMI

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