scholarly journals Special Issue on Nanometer-scale Machining and Processing Technology - From the Viewpoint of Chemical/Physical Reaction on Surfaces. Grinding, Lapping and Polishing Technologies under Nanometer Scale Working Conditions.

1993 ◽  
Vol 59 (4) ◽  
pp. 559-562 ◽  
Author(s):  
Toshio KASAI ◽  
Toshiro DOY
2017 ◽  
Vol 28 ◽  
pp. 363
Author(s):  
Albert Shih ◽  
Yinan Lai ◽  
Shiv G. Kapoor ◽  
Chuanzhen Huang ◽  
Fei Tao

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