Fluxless Solder Joining Using Alkane.

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits ◽

10.5104/jiep1995.13.103 ◽

1998 ◽

Vol 13 (2) ◽

pp. 103-108 ◽

Author(s):

Toshihiro MIYAKE ◽

Koji KONDO ◽

Fumio OHARA ◽

Nozomu OKUMURA

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