The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
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Published By Japan Institute Of Electronics Packaging

1884-1201, 1341-0571
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scholarly journals Development of a Quatitative Evaluation Method for Solderability of PWB.

1998 ◽  
Vol 13 (2) ◽  
pp. 109-114
Author(s):  
Tamiharu MASATOKI ◽  
Kenji AZUMA
Keyword(s):  
Evaluation Method

scholarly journals High Density PWB with BVH by Laser.

1998 ◽  
Vol 13 (1) ◽  
pp. 50-53
Author(s):  
Hiroyoshi YOKOYAMA ◽  
Toshirou OKAMURA
Keyword(s):  
High Density

scholarly journals Growth Kinetics of Intermetallic Compounds on the Boundary between Au and In-48Sn Solder.

1998 ◽  
Vol 13 (1) ◽  
pp. 24-29
Author(s):  
Ikuo SHOHJI ◽  
Shinichi FUJIWARA ◽  
Shinya KIYONO ◽  
Kojiro F.KOBAYASHI
Keyword(s):  
Intermetallic Compounds ◽  
Growth Kinetics ◽  
Kinetics Of

scholarly journals Fluxless Solder Joining Using Alkane.

1998 ◽  
Vol 13 (2) ◽  
pp. 103-108 ◽  
Author(s):  
Toshihiro MIYAKE ◽  
Koji KONDO ◽  
Fumio OHARA ◽  
Nozomu OKUMURA

scholarly journals A Film Formation Technology Using the Dispersed Ultra Fine Particle Paste.

1998 ◽  
Vol 13 (2) ◽  
pp. 119-121
Author(s):  
Toshihiro SUZUKI ◽  
Nobuya IMAZEKI ◽  
Shigeo HAYASHI ◽  
Masatoshi NOGUCHI ◽  
Kang-Hui YU ◽  
...  
Keyword(s):  
Fine Particle ◽  
Film Formation ◽  
Ultra Fine Particle
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