scholarly journals Three-dimensional deformation measurement based on digital speckle pattern interferometry

2020 ◽  
Vol 41 (4) ◽  
pp. 681-689
Author(s):  
WANG Yonghong ◽  
◽  
BAO Fengqing ◽  
ZHANG Xiao ◽  
ZHAO Qihan ◽  
...  
2017 ◽  
Vol 56 (6) ◽  
pp. 066107 ◽  
Author(s):  
Xinya Gao ◽  
Yonghong Wang ◽  
Junrui Li ◽  
Xizuo Dan ◽  
Sijin Wu ◽  
...  

2017 ◽  
Vol 868 ◽  
pp. 316-322 ◽  
Author(s):  
Yao Fang ◽  
Si Jin Wu ◽  
Lian Xiang Yang

Spatial-carrier digital speckle pattern interferometry (SC-DSPI) has proven to be a competitive tool for full-field deformation measurement. Comparing with traditional phase-shifting digital speckle pattern interferometry, SC-DSPI has the advantage of rapid measurement which guarantees that dynamic deformations can be precisely measured. In this article, a tri-channel SC-DSPI that measures three-dimensional deformations synchronously is introduced. Measuring algorithm as well as optical arrangement is described in detail. Experiments are carried out to verify the validity and evaluate the performance of the proposed technique.


2010 ◽  
Vol 39 (s1) ◽  
pp. 19-22 ◽  
Author(s):  
董会 DONG Hui ◽  
周岩 ZHOU Yan ◽  
郭俊 GUO Jun ◽  
张婉怡 ZHANG Wan-yi ◽  
王文生 WANG Wen-sheng

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