Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
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6

(FIVE YEARS 6)

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Published By CRC Press

9780429399619

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Electrothermal Modeling of Substrates

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement ◽

10.1201/9780429399619-4 ◽

2019 ◽

pp. 97-168

Author(s):

Yue Ma ◽

Christian Gontrand

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General Conclusion

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement ◽

10.1201/9780429399619-6 ◽

2019 ◽

pp. 213-214

Author(s):

Yue Ma ◽

Christian Gontrand

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Substrate Noise and Parasites: Toward 3D

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement ◽

10.1201/9780429399619-5 ◽

2019 ◽

pp. 169-212

Author(s):

Yue Ma ◽

Christian Gontrand

Keyword(s):

Substrate Noise

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Efficient and Simple Compact Modeling of Interconnects

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement ◽

10.1201/9780429399619-3 ◽

2019 ◽

pp. 47-96

Author(s):

Yue Ma ◽

Christian Gontrand

Keyword(s):

Compact Modeling

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Substrate Noise in Mixed-Signal ICs in a Silicon Process

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement ◽

10.1201/9780429399619-2 ◽

2019 ◽

pp. 13-45

Author(s):

Yue Ma ◽

Christian Gontrand

Keyword(s):

Substrate Noise ◽

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General Introduction

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement ◽

10.1201/9780429399619-1 ◽

2019 ◽

pp. 1-10

Author(s):

Yue Ma ◽

Christian Gontrand

Keyword(s):

General Introduction

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