IEEE Transactions on Device and Materials Reliability
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A New Scheme of the Low-Cost Multiple-Node-Upset-Tolerant Latch

2022 ◽  
pp. 1-1
Author(s):  
Xiaole Cui ◽  
Qixue Zhang ◽  
Xiaoxin Cui
Keyword(s):  
Low Cost ◽  
Multiple Node

Effect of titanium-polymer interactions on adhesion of polymer-copper redistribution layers in advanced packaging

2022 ◽  
pp. 1-1
Author(s):  
Pratik Nimbalkar ◽  
Christopher Blancher ◽  
Mohanalingam Kathaperumal ◽  
Madhavan Swaminathan ◽  
Rao Tummala
Keyword(s):  
Advanced Packaging ◽  
Polymer Interactions

scholarly journals Editorial Kudos to Our Reviewers

2021 ◽  
Vol 21 (4) ◽  
pp. 454-454
Author(s):  
Edmundo A. Gutierrez-D.
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