Modeling and Application of Flexible Electronics Packaging
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Published By Springer Singapore

9789811336263, 9789811336270
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Vacuum-Based Picking-up and Placing-on

2019 ◽  
pp. 227-279
Author(s):  
YongAn Huang ◽  
Zhouping Yin ◽  
Xiaodong Wan

Multi-needle Peeling

2019 ◽  
pp. 139-164
Author(s):  
YongAn Huang ◽  
Zhouping Yin ◽  
Xiaodong Wan

Tension-Assisted Peeling

2019 ◽  
pp. 73-103
Author(s):  
YongAn Huang ◽  
Zhouping Yin ◽  
Xiaodong Wan

Conformal Peeling

2019 ◽  
pp. 165-200
Author(s):  
YongAn Huang ◽  
Zhouping Yin ◽  
Xiaodong Wan

Laser Lift-off

2019 ◽  
pp. 201-225 ◽  
Author(s):  
YongAn Huang ◽  
Zhouping Yin ◽  
Xiaodong Wan
Keyword(s):  
Lift Off

Advanced Electronic Packaging

2019 ◽  
pp. 1-27
Author(s):  
YongAn Huang ◽  
Zhouping Yin ◽  
Xiaodong Wan
Keyword(s):  
Electronic Packaging

Single-needle Peeling

2019 ◽  
pp. 105-138
Author(s):  
YongAn Huang ◽  
Zhouping Yin ◽  
Xiaodong Wan
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