Abstract
The strain distribution along wood adhesive bonds was studied using a contact-free measurement system based on a white-light digital image correlation (DIC) technique. Two different specimen geometries and three different adhesives were investigated. The specimen geometries were according to the standards EN302-1 and ASTM D905. The adhesives tested were a phenolic resorcinol (PRF), a one-component polyurethane (PUR) and an epoxy (EPX). In addition to the experimental investigation, a finite element study using a non-linear fracture mechanics model for the adhesive bond line was carried out, aimed at investigating whether deformation measurements could predict differences in the mechanical behaviour of the adhesives. The measurement technique was found to be capable of distinguishing, in terms of their strain distributions at a given load, adhesives that differed markedly from one another. For example, the brittle PRF adhesive showed more localised strains than the more ductile EPX and PUR adhesives did at the same load level. Another conclusion from this study is that the measurement technique used is applicable to situations in which large strains occur. Thus, the technique used here is of great interest for use in the calibration of finite element models and constitutive theories and for the design of test set-ups.
Characterization of wood-adhesive bonds in wet conditions by means
of nanoindentation and tensile shear strength
