Glocalized Knowledge Structures through Transnational Public-Private Research and Technology Development Partnerships: Conclusions and Recommendations for Policies and Practices

This article investigates the evolving University–Industry–Government (UIG) linkages pattern in Taiwan, a latecomer catch-up country in terms of its late technology development and pursuing a targeted strategy of catch-up. The focus is on the funding sources available to universities and on their significance in defining the essentials of operating entrepreneurial universities. The results demonstrate that both public and private funding sources are important for assisting the build of entrepreneurial universities to reinforce such linkages, but their effects are divergent. The essential role of private research funding is not determined by the amount of funding, but is rather one of a guide to fill in the gaps in technological development between universities and industries. In comparison, public funding is a pre-requisite to and catalyst in attracting private research funding to bridge the gaps between university and industry research and to correct the misalignment of its impacts. The results also suggest that the UIG linkages available to an entrepreneurial university are closely associated with patterns of regional innovation and industrial development.

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Some applications of electron beam microanalysis techniques in VLSI process evaluation

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s042482010007463x ◽

1983 ◽

Vol 41 ◽

pp. 160-161

Author(s):

Simon Thomas

Keyword(s):

Integrated Circuits ◽

Process Evaluation ◽

Large Scale ◽

Technology Development ◽

Analytical Techniques ◽

Successful Implementation ◽

Analysis Of Failures ◽

Characterization Of Materials ◽

Circuits Vlsi

Trends in the technology development of very large scale integrated circuits (VLSI) have been in the direction of higher density of components with smaller dimensions. The scaling down of device dimensions has been not only laterally but also in depth. Such efforts in miniaturization bring with them new developments in materials and processing. Successful implementation of these efforts is, to a large extent, dependent on the proper understanding of the material properties, process technologies and reliability issues, through adequate analytical studies. The analytical instrumentation technology has, fortunately, kept pace with the basic requirements of devices with lateral dimensions in the micron/ submicron range and depths of the order of nonometers. Often, newer analytical techniques have emerged or the more conventional techniques have been adapted to meet the more stringent requirements. As such, a variety of analytical techniques are available today to aid an analyst in the efforts of VLSI process evaluation. Generally such analytical efforts are divided into the characterization of materials, evaluation of processing steps and the analysis of failures.

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