scholarly journals Developing new joining materials for low-temperature electronics assembly

Author(s):  
P. Roumanille ◽  
V. Baco ◽  
C. Bonningue ◽  
M. Gougeon ◽  
P. Tailhades ◽  
...  
2017 ◽  
Vol 32 (8) ◽  
pp. 080201 ◽  
Author(s):  
Mikael Östling ◽  
Edmundo Gutierrez ◽  
Daniel Alquier ◽  
Eddy Simoen

1990 ◽  
Vol 6 (2) ◽  
pp. 12-24 ◽  
Author(s):  
R.K. Kirschman

Cryogenics ◽  
1988 ◽  
Vol 28 (5) ◽  
pp. 357
Author(s):  
W. Jutzi

1988 ◽  
Vol 19 (4) ◽  
pp. 7-12 ◽  
Author(s):  
R.L. Anderson ◽  
J.L. Hill

2010 ◽  
Vol 22 (44) ◽  
pp. 5039-5042 ◽  
Author(s):  
Yifeng Fu ◽  
Yiheng Qin ◽  
Teng Wang ◽  
Si Chen ◽  
Johan Liu

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