Structural optimization of reducing the thermal stress and Smile in packaging a high-power diode laser array on a microchannel cooler using gold-tin hard solder
Keyword(s):
2013 ◽
Vol 25
(8)
◽
pp. 1904-1910
◽
2013 ◽
Vol 25
(10)
◽
pp. 2561-2564
Keyword(s):