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packaging technology
Recently Published Documents
TOTAL DOCUMENTS
934
(FIVE YEARS 131)
H-INDEX
30
(FIVE YEARS 4)
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Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Packaging technology for home meal replacement: Innovations and future prospective
Food Control
◽
10.1016/j.foodcont.2021.108470
◽
2022
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Vol 132
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pp. 108470
Author(s):
Nattinee Bumbudsanpharoke
◽
Seonghyuk Ko
Keyword(s):
Meal Replacement
◽
Packaging Technology
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On future packaging Technology and Science
Packaging Technology and Science
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10.1002/pts.2630
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2021
◽
Author(s):
Jun Wang
Keyword(s):
Packaging Technology
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Irreversible Processes in Electronic Packaging Technology
10.1002/9781119418344.ch9
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2021
◽
pp. 191-219
Keyword(s):
Electronic Packaging
◽
Irreversible Processes
◽
Packaging Technology
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Low stray inductance packaging technology
10.1117/12.2618213
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2021
◽
Author(s):
Maotong Yang
◽
William Cai
◽
Minghao Zhou
◽
Qingbo Guo
Keyword(s):
Packaging Technology
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Chip Stacking and Packaging Technology Explorations for Hardware Security (Invited)
10.1109/slip52707.2021.00012
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2021
◽
Author(s):
Makoto Nagata
Keyword(s):
Hardware Security
◽
Packaging Technology
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Co-optimizing signaling protocol with semiconductor and packaging technology
10.1109/epeps51341.2021.9609161
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2021
◽
Author(s):
Krutikesh Sahoo
◽
Bapi Vinnakota
◽
Shahab Ardalan
◽
Subramanian S. Iyer
Keyword(s):
Packaging Technology
◽
Signaling Protocol
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Fruit preservation packaging technology based on air adjustment packaging method
Food Science and Technology
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10.1590/fst.29221
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2021
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Author(s):
Agus DWI ANGGONO
◽
Maksim REBEZOV
◽
Sergey MIRONOV
◽
Lakshmi THANGAVELU
◽
Surendar ARAVINDHAN
◽
...
Keyword(s):
Packaging Technology
◽
Fruit Preservation
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Electroplating nanotwinned copper for ultrafine pitch redistribution layer (RDL) of advanced packaging technology
10.1109/icept52650.2021.9567993
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2021
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Author(s):
Yu-Bo Zhang
◽
Li-Yin Gao
◽
Xiao Li
◽
Zhe Li
◽
Xu-Liang Ma
◽
...
Keyword(s):
Packaging Technology
◽
Advanced Packaging
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Power Semiconductor IGBT Packaging Technology and Reliability
10.1109/wipdaasia51810.2021.9656010
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2021
◽
Author(s):
Yameng Sun
◽
Shizhao Wang
◽
Lianghao Xue
◽
Zheng Feng
◽
Rui Li
◽
...
Keyword(s):
Packaging Technology
◽
Power Semiconductor
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The Invention Relates to a Low Stress Packaging Technology for a High Temperature Pressure Sensor
10.47939/et.v2i6.148
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2021
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Keyword(s):
High Temperature
◽
Pressure Sensor
◽
Packaging Technology
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