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High reliability mid-temperature pb-free alloy for multi-step soldering

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2017.8277487 ◽

2017 ◽

Author(s):

Pritha Choudhury ◽

Morgana Ribas ◽

Siuli Sarkar

Keyword(s):

High Reliability ◽

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Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

Journal of Electronic Materials ◽

10.1007/s11664-006-0302-y ◽

2006 ◽

Vol 35 (11) ◽

pp. 1975-1981 ◽

Author(s):

Sun-Kyoung Seo ◽

Moon Gi Cho ◽

Hyuck Mo Lee ◽

Won Kyoung Choi

Keyword(s):

Intermediate Step ◽

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