Proceedings of the 2021 International Symposium on Physical Design
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9781450383004

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Session details: Session 9: Brains, Computers and EDA

Proceedings of the 2021 International Symposium on Physical Design ◽

10.1145/3457133 ◽

2021 ◽

Author(s):

Patrick Groeneveld

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Session details: Session 1: Opening Session and First Keynote

Proceedings of the 2021 International Symposium on Physical Design ◽

10.1145/3457126 ◽

2021 ◽

Author(s):

Jens Lienig

Keyword(s):

Opening Session

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Hardware Security for and beyond CMOS Technology

Proceedings of the 2021 International Symposium on Physical Design ◽

10.1145/3439706.3446902 ◽

2021 ◽

Author(s):

Johann Knechtel

Keyword(s):

Hardware Security ◽

Cmos Technology ◽

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A Fast Power Network Optimization Algorithm for Improving Dynamic IR-drop

Proceedings of the 2021 International Symposium on Physical Design ◽

10.1145/3439706.3447042 ◽

2021 ◽

Author(s):

Jai-Ming Lin ◽

Yang-Tai Kung ◽

Zheng-Yu Huang ◽

I-Ru Chen

Keyword(s):

Optimization Algorithm ◽

Network Optimization ◽

Power Network ◽

Ir Drop ◽

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Learning Point Clouds in EDA

Proceedings of the 2021 International Symposium on Physical Design ◽

10.1145/3439706.3446895 ◽

2021 ◽

Author(s):

Wei Li ◽

Guojin Chen ◽

Haoyu Yang ◽

Ran Chen ◽

Bei Yu

Keyword(s):

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ISPD 2021 Wafer-Scale Physics Modeling Contest

Proceedings of the 2021 International Symposium on Physical Design ◽

10.1145/3439706.3446904 ◽

2021 ◽

Author(s):

Patrick Groeneveld ◽

Michael James ◽

Vladimir Kibardin ◽

Ilya Sharapov ◽

Marvin Tom ◽

...

Keyword(s):

Wafer Scale ◽

Physics Modeling

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Reinforcement Learning for Placement Optimization

Proceedings of the 2021 International Symposium on Physical Design ◽

10.1145/3439706.3446883 ◽

2021 ◽

Author(s):

Anna Goldie ◽

Azalia Mirhoseini

Keyword(s):

Reinforcement Learning ◽

Placement Optimization

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Session details: Session 3: Advances in Placement

Proceedings of the 2021 International Symposium on Physical Design ◽

10.1145/3457128 ◽

2021 ◽

Author(s):

Joseph Shinnerl

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Session details: Session 8: Monolithic 3D and Packaging Session

Proceedings of the 2021 International Symposium on Physical Design ◽

10.1145/3457132 ◽

2021 ◽

Author(s):

Bill Swartz

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Physical Design for 3D Chiplets and System Integration

Proceedings of the 2021 International Symposium on Physical Design ◽

10.1145/3439706.3446881 ◽

2021 ◽

Author(s):

Frank J.C. Lee

Keyword(s):

System Integration ◽

Physical Design

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