Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
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Published By Springer US

9781461349891, 9781461502555

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Mechanical Bending Fatigue Life Prediction Analysis

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® ◽

10.1007/978-1-4615-0255-5_3 ◽

2003 ◽

pp. 69-86

Author(s):

Erdogan Madenci ◽

Ibrahim Guven ◽

Bahattin Kilic

Keyword(s):

Fatigue Life ◽

Life Prediction ◽

Fatigue Life Prediction ◽

Bending Fatigue ◽

Prediction Analysis ◽

Mechanical Bending

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Thermomechanical Fatigue Life Prediction Analysis

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® ◽

10.1007/978-1-4615-0255-5_2 ◽

2003 ◽

pp. 17-68

Author(s):

Erdogan Madenci ◽

Ibrahim Guven ◽

Bahattin Kilic

Keyword(s):

Fatigue Life ◽

Life Prediction ◽

Thermomechanical Fatigue ◽

Fatigue Life Prediction ◽

Prediction Analysis

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Macro Reference Library

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® ◽

10.1007/978-1-4615-0255-5_4 ◽

2003 ◽

pp. 87-161

Author(s):

Erdogan Madenci ◽

Ibrahim Guven ◽

Bahattin Kilic

Keyword(s):

Reference Library

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Introduction

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® ◽

10.1007/978-1-4615-0255-5_1 ◽

2003 ◽

pp. 1-16

Author(s):

Erdogan Madenci ◽

Ibrahim Guven ◽

Bahattin Kilic

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