1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)
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A new economical wafer drying technology with high process performance

1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) ◽

10.1109/issm.1997.664555 ◽

2002 ◽

Author(s):

K. Asada ◽

H. Iwamoto ◽

T. Hashiguchi ◽

Y. Okamoto ◽

T. Minami ◽

...

Keyword(s):

Process Performance ◽

Drying Technology

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Managing overall equipment effectiveness [OEE] to optimize factory performance

1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) ◽

10.1109/issm.1997.664488 ◽

2002 ◽

Author(s):

T. Pomorski

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Training time reduction in producing certified manufacturing technicians for a fabrication environment

1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) ◽

10.1109/issm.1997.664483 ◽

2002 ◽

Author(s):

F. Sheehy

Keyword(s):

Training Time ◽

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AMHS for 300 mm wafer

1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) ◽

10.1109/issm.1997.664525 ◽

2002 ◽

Author(s):

R. Kurosaki ◽

N. Nagao ◽

H. Komada ◽

Y. Watanabe ◽

H. Yano

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Metallic contaminants generation from tubing during start-up and following moisture upsets in HCl distribution systems

1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) ◽

10.1109/issm.1997.664629 ◽

2002 ◽

Author(s):

N. Anderson ◽

G. Vereecke ◽

M.M. Heyns ◽

P. Espitalier-Noel

Keyword(s):

Distribution Systems ◽

Start Up ◽

Metallic Contaminants

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An integrated approach to planning and scheduling at Philips Semiconductors

1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) ◽

10.1109/issm.1997.664528 ◽

2002 ◽

Author(s):

C. Malmstrom

Keyword(s):

Integrated Approach ◽

Planning And Scheduling

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Modular metrology tools for productivity enhancement in wafer fabs

1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) ◽

10.1109/issm.1997.664498 ◽

2002 ◽

Author(s):

C. Schneider ◽

L. Pfitzner ◽

H. Ryssel

Keyword(s):

Productivity Enhancement

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Wafer zone based yield analysis

1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) ◽

10.1109/issm.1997.664591 ◽

2002 ◽

Author(s):

N. Atchison ◽

R. Ross

Keyword(s):

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Advanced techniques for contact module development

1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) ◽

10.1109/issm.1997.664634 ◽

2002 ◽

Author(s):

S. Zika ◽

P.L. King ◽

J. Pak

Keyword(s):

Module Development

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Integrated test facility (ITF)-automation testing to support Intel's manufacturing output

1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) ◽

10.1109/issm.1997.664526 ◽

2002 ◽

Author(s):

J. Bisgrove ◽

R. Dayao ◽

B. Houser ◽

T. Jones ◽

J.C. Mayes ◽

...

Keyword(s):

Test Facility ◽

Automation Testing

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