Proceedings of the International Conference on Multichip Modules
Latest Publications

TOTAL DOCUMENTS

98
(FIVE YEARS 0)

H-INDEX

7
(FIVE YEARS 0)

Published By IEEE

0930815394
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Reliability Comparison of Two Metallurgies for Ceramic Ball Grid Array

2005 ◽  
Author(s):  
D.R. Banks ◽  
T.E. Bunette ◽  
R.D. Gerke ◽  
E. Mammo ◽  
S. Mattay
Keyword(s):  
Ball Grid Array ◽  
Ceramic Ball

Thin Film Programmable Interconnect Arrays

2005 ◽  
Author(s):  
A.B. Frazier ◽  
R.M. Powers ◽  
M.G. Allen
Keyword(s):  
Thin Film

Thin-Profile MCM-D Packaging for Small Form Factor Applications

2005 ◽  
Author(s):  
A. Bet-Shliemoun ◽  
M. McGraw ◽  
B. Griswold ◽  
Chung Ho ◽  
S. Westbrook
Keyword(s):  
Form Factor ◽  
Small Form ◽  
Thin Profile ◽  
Small Form Factor

Applications of Latent Open Test

2005 ◽  
Author(s):  
L. Economikos ◽  
Shinwu Chiang ◽  
A. Halperin
Keyword(s):  
Open Test

An ATM Switching Module using MCM-C Technology

2005 ◽  
Author(s):  
M. Yamada ◽  
Y. Otsuki ◽  
T. Kikuchi ◽  
H. Shibuya
Load More ...
Sign in / Sign up

Export Citation Format

Share Document