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Proceedings of the International Conference on Multichip Modules
Latest Publications
TOTAL DOCUMENTS
98
(FIVE YEARS 0)
H-INDEX
7
(FIVE YEARS 0)
Published By IEEE
0930815394
Latest Documents
Most Cited Documents
Contributed Authors
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Related Keywords
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Design and Test of a Complex Mcm Product
Proceedings of the International Conference on Multichip Modules
◽
10.1109/icmcm.1994.753550
◽
2005
◽
Cited By ~ 1
Author(s):
W. Blood
◽
A. Flint
Download Full-text
Advanced Mcm-d With Embedded Resistors
Proceedings of the International Conference on Multichip Modules
◽
10.1109/icmcm.1994.753562
◽
2005
◽
Cited By ~ 3
Author(s):
D. Scheid
Keyword(s):
Embedded Resistors
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Reliability Comparison of Two Metallurgies for Ceramic Ball Grid Array
Proceedings of the International Conference on Multichip Modules
◽
10.1109/icmcm.1994.753601
◽
2005
◽
Cited By ~ 2
Author(s):
D.R. Banks
◽
T.E. Bunette
◽
R.D. Gerke
◽
E. Mammo
◽
S. Mattay
Keyword(s):
Ball Grid Array
◽
Ceramic Ball
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Development of a Dsp Function Using a Mcm Technology
Proceedings of the International Conference on Multichip Modules
◽
10.1109/icmcm.1994.753578
◽
2005
◽
Author(s):
M. Michaud
◽
J.C. Rames
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Thin Film Programmable Interconnect Arrays
Proceedings of the International Conference on Multichip Modules
◽
10.1109/icmcm.1994.753565
◽
2005
◽
Author(s):
A.B. Frazier
◽
R.M. Powers
◽
M.G. Allen
Keyword(s):
Thin Film
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Thin-Profile MCM-D Packaging for Small Form Factor Applications
Proceedings of the International Conference on Multichip Modules
◽
10.1109/icmcm.1994.753590
◽
2005
◽
Author(s):
A. Bet-Shliemoun
◽
M. McGraw
◽
B. Griswold
◽
Chung Ho
◽
S. Westbrook
Keyword(s):
Form Factor
◽
Small Form
◽
Thin Profile
◽
Small Form Factor
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Applications of Latent Open Test
Proceedings of the International Conference on Multichip Modules
◽
10.1109/icmcm.1994.753552
◽
2005
◽
Cited By ~ 1
Author(s):
L. Economikos
◽
Shinwu Chiang
◽
A. Halperin
Keyword(s):
Open Test
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Choosing an Mcm Technology for Thermal Performance
Proceedings of the International Conference on Multichip Modules
◽
10.1109/icmcm.1994.753604
◽
2005
◽
Cited By ~ 3
Author(s):
J.C. Demmin
Keyword(s):
Thermal Performance
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An ATM Switching Module using MCM-C Technology
Proceedings of the International Conference on Multichip Modules
◽
10.1109/icmcm.1994.753539
◽
2005
◽
Author(s):
M. Yamada
◽
Y. Otsuki
◽
T. Kikuchi
◽
H. Shibuya
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Algorithmic Diagnosis of Multichip Module Defects Using the IEEE 1149.1 Standard
Proceedings of the International Conference on Multichip Modules
◽
10.1109/icmcm.1994.753551
◽
2005
◽
Cited By ~ 1
Author(s):
K. Posse
Keyword(s):
Multichip Module
◽
Ieee 1149.1
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