scholarly journals Cyclic Level Planarity Testing and Embedding

Author(s):  
Christian Bachmaier ◽  
Wolfgang Brunner ◽  
Christof König
Keyword(s):  
Author(s):  
Patrizio Angelini ◽  
Giordano Da Lozzo ◽  
Giuseppe Di Battista ◽  
Fabrizio Frati ◽  
Maurizio Patrignani ◽  
...  
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Author(s):  
Radoslav Fulek ◽  
Michael J. Pelsmajer ◽  
Marcus Schaefer ◽  
Daniel Štefankovič
Keyword(s):  

2001 ◽  
Vol 671 ◽  
Author(s):  
Kyung-Hyun Kim ◽  
Yoo-Hyon Kim ◽  
Kwang-Bok Kim ◽  
Chang-Ki Hong ◽  
Moon-Hyun Yoo

ABSTRACTSimulation of chemical-mechanical polishing is important because the chip-level planarity are difficult to control. The simulator has been developed for predicting and optimizing the thickness distribution after the STI and damascene CMP as well as ILD CMP using chip-level pattern density, elastic spring model and erosion model. In this study, the results of CMP simulation is shown to agree well with the measured data. The simulator can be used to optimize CMP process conditions and to generate design rules for filling dummy patterns which are used to improve the planarity and uniformity.


Author(s):  
Guido Brückner ◽  
Ignaz Rutter ◽  
Peter Stumpf
Keyword(s):  

Author(s):  
Christian Bachmaier ◽  
Franz J. Brandenburg ◽  
Michael Forster
Keyword(s):  

2005 ◽  
Vol 9 (1) ◽  
pp. 53-97 ◽  
Author(s):  
Christian Bachmaier ◽  
Franz J. Brandenburg ◽  
Michael Forster
Keyword(s):  

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