scholarly journals Deriving ultrametric tree structures from proximity data confounded by differential stimulus familiarity

Psychometrika ◽  
1994 ◽  
Vol 59 (4) ◽  
pp. 527-566 ◽  
Author(s):  
Wayne S. DeSarbo ◽  
Rabikar Chatterjee ◽  
Juyoung Kim
Keyword(s):  
Proximity Data ◽  
Tree Structures ◽  
Ultrametric Tree ◽  
Differential Stimulus ◽  
Stimulus Familiarity

A Multidimensional Scaling Model Accommodating Differential Stimulus Familiarity

1998 ◽  
Vol 33 (1) ◽  
pp. 41-63 ◽  
Author(s):  
Tammo H.A. Bijmolt ◽  
Wayne S. DeSarbo ◽  
Michel Wedel
Keyword(s):  
Multidimensional Scaling ◽  
Scaling Model ◽  
Differential Stimulus ◽  
Stimulus Familiarity

scholarly journals A parametric procedure for ultrametric tree estimation from conditional rank order proximity data

Psychometrika ◽  
1995 ◽  
Vol 60 (1) ◽  
pp. 47-75 ◽  
Author(s):  
Martin R. Young ◽  
Wayne S. DeSarbo
Keyword(s):  
Rank Order ◽  
Proximity Data ◽  
Ultrametric Tree ◽  
Tree Estimation

Tree structures for proximity data

1981 ◽  
Vol 34 (2) ◽  
pp. 167-180 ◽  
Author(s):  
H. Colonius ◽  
H. H. Schulze
Keyword(s):  
Proximity Data ◽  
Tree Structures

Does Stimulus Familiarity Influence the Preview Effect in Visual Search?

2008 ◽  
Author(s):  
Jun-Ichi Nagai
Keyword(s):  
Visual Search ◽  
Stimulus Familiarity

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

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