ScienceGate
Advanced Search
Author Search
Journal Finder
Blog
Sign in / Sign up
ScienceGate
Search
Author Search
Journal Finder
Blog
Sign in / Sign up
dual damascene
Recently Published Documents
TOTAL DOCUMENTS
471
(FIVE YEARS 11)
H-INDEX
24
(FIVE YEARS 1)
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Failure Mechanism of Stress Migration in Via Sidewall for Dual Damascene Cu Interconnection
10.1109/ipfa53173.2021.9617384
◽
2021
◽
Author(s):
Yu Chun Teng
◽
Liwei Yang
Keyword(s):
Failure Mechanism
◽
Dual Damascene
Download Full-text
In-situ SEM micromechanical experiments on Dual Damascene Copper test structures for investigation of interfacial properties of copper interconnects
10.1109/ipfa53173.2021.9617276
◽
2021
◽
Author(s):
Wieland Heyn
◽
Hanno Melzner
◽
Klaus Goller
◽
Sergey Ananiev
◽
Andre Clausner
◽
...
Keyword(s):
Interfacial Properties
◽
Copper Interconnects
◽
Dual Damascene
Download Full-text
Exploring W-Cu hybrid dual damascene metallization for future nodes
10.1109/iitc51362.2021.9537410
◽
2021
◽
Author(s):
Marleen H. van der Veen
◽
O. Varela Pedreira
◽
N. Heylen
◽
N. Jourdan
◽
S. Lariviere
◽
...
Keyword(s):
Dual Damascene
Download Full-text
A Study of Inter-Via CD and PEB Amount Correlation in Dual Damascene Process
2021 China Semiconductor Technology International Conference (CSTIC)
◽
10.1109/cstic52283.2021.9461471
◽
2021
◽
Author(s):
Xinruo Su
◽
Xuebing Zhao
◽
Yuan Li
◽
Jun Wang
Keyword(s):
Dual Damascene
◽
Damascene Process
Download Full-text
Marangoni effect-based under-layer for a Dual Damascene via-first approach: a scalable solution to the unwanted photoresist swing effect
Advances in Patterning Materials and Processes XXXVII
◽
10.1117/12.2551864
◽
2020
◽
Author(s):
Valentina Dall'Asta
◽
Emma Litterio
◽
Nicoletta Corneo
◽
Jakub Koza
◽
Jonathan Jeauneau
◽
...
Keyword(s):
Marangoni Effect
◽
Dual Damascene
Download Full-text
Copper Diffusion and Corrosion Behavior Through the Hillock Defect Found Beneath the Weak SiN Dielectric Barrier in Dual Damascene Process
ECS Transactions
◽
10.1149/1.2193894
◽
2019
◽
Vol 2
(1)
◽
pp. 237-241
Author(s):
Rosa María Luna-Sánchez
◽
Ignacio González-Martínez
Keyword(s):
Corrosion Behavior
◽
Dielectric Barrier
◽
Copper Diffusion
◽
Dual Damascene
◽
Damascene Process
Download Full-text
Analysis of Electromigration in Dual-Damascene Interconnect Structures
ECS Transactions
◽
10.1149/1.2956048
◽
2019
◽
Vol 14
(1)
◽
pp. 337-348
Author(s):
Roberto Lacerda de Orio
◽
Sara Carniello
◽
Hajdin Ceric
◽
Siegfried Selberherr
Keyword(s):
Dual Damascene
Download Full-text
Novel Hardmask for Sub-20nm Copper/Low K Backend Dual Damascene Integration
ECS Transactions
◽
10.1149/1.3572311
◽
2019
◽
Vol 35
(4)
◽
pp. 651-665
◽
Cited By ~ 4
Author(s):
Li-Qun Xia
◽
Zhenjiang Cui
◽
Mihaela Balseanu
◽
Victor Nguyen
◽
Kevin Zhou
◽
...
Keyword(s):
Dual Damascene
◽
Low K
Download Full-text
The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects
ECS Transactions
◽
10.1149/1.3567674
◽
2019
◽
Vol 34
(1)
◽
pp. 787-792
Author(s):
Ya-Lu Cao
◽
Charles Xing
◽
Neil Xu
◽
Hua Zhou
◽
Allen Bian
◽
...
Keyword(s):
Cu Interconnects
◽
Dual Damascene
◽
Voltage Breakdown
Download Full-text
TiN Metal Hardmask Etch Residues Removal for Cu Dual Damascene Devices with TiN Mask Corner Rounding Scheme
ECS Transactions
◽
10.1149/1.3694342
◽
2019
◽
Vol 44
(1)
◽
pp. 377-381
◽
Cited By ~ 1
Author(s):
Hua Cui
Keyword(s):
Dual Damascene
◽
Tin Metal
Download Full-text
Load More ...
Sign in / Sign up
Close
Export Citation Format
Close
Share Document
Close