Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials

2010 ◽  
Vol 42 (5) ◽  
pp. 1310-1324 ◽  
Author(s):  
Xinjian Yuan ◽  
Myung Bok Kim ◽  
Chung Yun Kang
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