Steady spatially-periodic eutectic growth with the effect of triple point in directional solidification

2014 ◽  
Vol 80 ◽  
pp. 220-238 ◽  
Author(s):  
Jian-Jun Xu ◽  
Yong-Qiang Chen
Keyword(s):  
Directional Solidification ◽  
Triple Point ◽  
Eutectic Growth ◽  
Spatially Periodic

THE EFFECT OF ANISOTROPIC SURFACE TENSION ON THE LAMELLAR EUTECTIC GROWTH IN DIRECTIONAL SOLIDIFICATION

2019 ◽  
Vol 26 (07) ◽  
pp. 1850216
Author(s):  
XIAOHUA XU ◽  
MINGWEN CHEN
Keyword(s):  
Surface Tension ◽  
Directional Solidification ◽  
Triple Point ◽  
Eutectic Growth ◽  
Solute Diffusion ◽  
Interface Temperature ◽  
Lamellar Eutectic ◽  
Anisotropic Effect ◽  
Anisotropic Surface ◽  
Effect Of Surface

For the case of small interlamellar spacing relative to the solute diffusion length, the steady spatially periodic lamellar eutectic growth with the anisotropic effect of surface tension in directional solidification is studied by the approach of the interfacial wave (IFW) theory. The anisotropic surface tension is expressed as the fourfold symmetric function. We obtained a family of the uniformly valid asymptotic solutions for the steady lamellar eutectic growth and determined the corresponding interfacial patterns affected by anisotropic surface tension. The analytical solution reveals the anisotropic effect of surface tension on the interface shape of lamellar eutectic growth near the triple point. The temperature distribution at the interface shows a noticeable nonuniformity and there is a thin boundary layer for temperature and concentration near the triple point. As the anisotropic surface tension increases, the interface temperature away from the triple-point increases, whereas near the triple point the interface temperature decreases. Compared with the lamellar eutectic growth with isotropic surface tension, the anisotropic surface tension changes the position of the triple point and accelerates the growth of the lamellar eutectic. The theoretical prediction shows quantitatively consistent with recent experimental data without making any artificial adjustments to parameters.

Initial dynamics of irregular eutectic growth under directional solidification

2021 ◽  
pp. 130464
Author(s):  
Lili Tian ◽  
Yinli Peng ◽  
Xing He ◽  
Yang Bai ◽  
Xiaowei Lei ◽  
...  
Keyword(s):  
Directional Solidification ◽  
Eutectic Growth

Ternary eutectic growth during directional solidification of Ag–Cu–Sb alloy

2015 ◽  
Vol 95 (4) ◽  
pp. 187-193 ◽  
Author(s):  
Wei Zhai ◽  
Baojian Wang ◽  
Liang Hu ◽  
Bingbo Wei
Keyword(s):  
Directional Solidification ◽  
Ternary Eutectic ◽  
Eutectic Growth

Effects of Applied Electric Fields on Interface Dynamics and Microstructure Formation During Directional Solidification of BiMn/Bi Eutectic

2000 ◽  
Author(s):  
L. L. Zheng
Keyword(s):  
Electric Field ◽  
Directional Solidification ◽  
Electric Fields ◽  
Microscopic Analysis ◽  
Eutectic Growth ◽  
Macroscopic Model ◽  
Microstructure Formation ◽  
Applied Current ◽  
Thermoelectric Effects ◽  
Interface Dynamics

Abstract This paper is to demonstrate that the presence of an electric field can be used to control materials microstructure formation. Special efforts have been made to identify the foremost process control parameters that affect the interface dynamics, and thermoelectric effects on materials microstructure formation during directional solidification. A computational model that integrates microscopic analysis to macroscopic model has been developed and applied to directional solidification of BiMn/Bi eutectic in the presence of electric fields. Numerical results demonstrated that in addition to process parameters, microstructure formation strongly depends on intensity, polarity and duration of applied current, and it changes spontaneously as an electric field is applied. Predicted patterns of microstructures have qualitatively agreed with the experiments. The results indicate the feasibility of utilizing electric fields to control microstructure formation during eutectic growth.

Selection of doublet cellular patterns in directional solidification through spatially periodic perturbations

1998 ◽  
Vol 58 (6) ◽  
pp. 7492-7506 ◽  
Author(s):  
W. Losert ◽  
D. A. Stillman ◽  
H. Z. Cummins ◽  
P. Kopczyński ◽  
W.-J. Rappel ◽  
...  
Keyword(s):  
Directional Solidification ◽  
Periodic Perturbations ◽  
Spatially Periodic ◽  
Selection Of

A steady solution of the gasar eutectic growth in directional solidification

2013 ◽  
Vol 22 (7) ◽  
pp. 078101 ◽  
Author(s):  
Xiang-Ming Li ◽  
Wen-Qiong Li ◽  
Qing-Lin Jin ◽  
Rong Zhou
Keyword(s):  
Directional Solidification ◽  
Eutectic Growth ◽  
Steady Solution

Analysis of the Microstructural Evolution during the Transient Upward, Downward and Horizontal Directional Solidification of the Al-1.2wt%Pb Monotectic Alloy

2016 ◽  
Vol 869 ◽  
pp. 429-434 ◽  
Author(s):  
Camila Yuri Negrão Konno ◽  
Angela J. Vasconcelos ◽  
André Santos Barros ◽  
Adrina P. Silva ◽  
Otávio Fernandes Lima da Rocha ◽  
...  
Keyword(s):  
Directional Solidification ◽  
Microstructural Evolution ◽  
Convective Flow ◽  
Tribological Behavior ◽  
Eutectic Growth ◽  
Monotectic Reaction ◽  
Flow Conditions ◽  
Power Functions ◽  
Monotectic Alloy ◽  
Transient Heat Flow

Monotectic alloys are of great industrial importance because of their favorable tribological behavior. Many studies in order to better understand the morphologies obtained by monotectic reaction have been developed. To better understand the morphologies obtained by monotectic Al-1.2wt%Pb alloy reaction, especially in relation to induced convective flow, this paper aims to compare the microstructural evolution of the alloy obteind by directional solidification in transient heat-flow conditions in upward, downwand and horizontal solidification devices. It was observed a morphology transition from particles to fibers on upward and downward cases and a morphology of only particles on the horizontal case. The classical relationship used for eutectic growth, λ2v = C, which was considered applicable to monotectic reactions, didn’t seemed to be valid in the interphase spacing evolution for the downward device, however power functions (λ = C.va) were found in all cases.

Sign in / Sign up

Export Citation Format

Share Document