scholarly journals Lightweight Mesh File Format Using Repetition Pattern Encoding for Additive Manufacturing

2020 ◽  
Vol 129 ◽  
pp. 102914
Author(s):  
Benjamin Vaissier ◽  
Jean-Philippe Pernot ◽  
Laurent Chougrani ◽  
Philippe Véron
2017 ◽  
Vol 23 (1) ◽  
pp. 34-43 ◽  
Author(s):  
Kai-Ming Yu ◽  
Yu Wang ◽  
Charlie C.L. Wang

Purpose In the newly released ASTM standard specification for additive manufacturing file (AMF) format – version 1.1 – Hermite curve-based interpolation is used to refine input triangles to generate denser mesh with smoother geometry. This paper aims to study the problems of constructing smooth geometry based on Hermite interpolation on curves and proposes a solution to overcome these problems. Design/methodology/approach A formulation using triangular Bézier patch is proposed to generate smooth geometry from input polygonal models. Different configurations on the boundary curves in the formulation are analyzed to further enrich this formulation. Findings The study shows that the formulation given in the AMF format (version 1.1) can lead to the problems of inconsistent normals and undefined end-tangents. Research limitations/implications The scheme has requirements on the input normals of a model, only C0 interpolation can be generated on those cases with less-proper input. Originality/value To overcome the problems of smooth geometry generation in the AMF format, the authors propose an enriched scheme for computing smooth geometry by using triangular Bézier patch. For the configurations with less-proper input, the authors adopt the Boolean sum and the Nielson’s point-opposite edge interpolation for triangular Coons patch to generate the smooth geometry as a C0 interpolant.


Author(s):  
Neeraj Panhalkar ◽  
Ratnadeep Paul ◽  
Sam Anand

Additive Manufacturing (AM) based Printed Electronics (PE) is an emerging technique where electronic components and interconnects are printed directly on substrates using a layered technique. The direct printing of the electronic components allows large scale and ultra-thin components to be printed on a wide variety of substrates including glass, silicon and plastic. These attributes make AM based Printed Electronics an invaluable manufacturing technique in the area of electronic sensors and sensor networks where thin, flexible and rugged form factors are very important. However, currently this technology is a labor intensive and manual process with the machine operator using his experience and judgment to slice the CAD file of the part to create 2D layers at different levels. This manual process increases the overall production time as well as the cost of the product and also results in inconsistent quality of parts. A major challenge faced by existing AM based Printed Electronics users for automating this process is the lack of a standard input file format that can be used by different PE machines for producing the components in layers. To leverage the capabilities of both AM and PE processes, a new file format based on the Constructive Solid Geometry (CSG) technique is proposed in this research paper. This file format data will not only include CAD data in the form of CSG primitives and Boolean representation but will also include manufacturing information related to the AM based PE process. The manufacturing information embedded within this new format will include data about the location of the different electronic components such as interconnects, resistors, capacitors, inductors, transistors, memory and substrate, and the materials required for the different components part. Different circuit board components will be represented as primitives or a combination of primitives obtained using CSG technique. In addition to the new file format, a slicing algorithm will also be developed which can be used to create the layers automatically using user inputs. The proposed file format and the slicing algorithm will be explained with the help of a case study.


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