Electroless copper plating using hypophosphite as reducing agent

1997 ◽  
Vol 95 (1) ◽  
pp. 34-37 ◽  
Author(s):  
D.H. Cheng ◽  
W.Y. Xu ◽  
Z.Y. Zhang ◽  
Z.H. Yiao
Keyword(s):  
Reducing Agent ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless copper plating using FeII as a reducing agent

2004 ◽  
Vol 49 (2) ◽  
pp. 233-238 ◽  
Author(s):  
Michinari Sone ◽  
Koichi Kobayakawa ◽  
Makoto Saitou ◽  
Yuichi Sato
Keyword(s):  
Reducing Agent ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless copper plating on PET fabrics using hypophosphite as reducing agent

2007 ◽  
Vol 201 (16-17) ◽  
pp. 7018-7023 ◽  
Author(s):  
Xueping Gan ◽  
Yating Wu ◽  
Lei Liu ◽  
Bin Shen ◽  
Wenbin Hu
Keyword(s):  
Reducing Agent ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Role of additives in electroless copper plating using hypophosphite as reducing agent

2012 ◽  
Vol 206 (15) ◽  
pp. 3405-3409 ◽  
Author(s):  
Xueping Gan ◽  
Kechao Zhou ◽  
Wenbin Hu ◽  
Dou Zhang
Keyword(s):  
Reducing Agent ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Influence of N-N dimethyl formamide on electroless copper plating using hypophosphite as reducing agent

2014 ◽  
Vol 245 ◽  
pp. 22-27 ◽  
Author(s):  
T. Anik ◽  
A. EL Haloui ◽  
M. Ebn Touhami ◽  
R. Touir ◽  
H. Larhzil ◽  
...  
Keyword(s):  
Reducing Agent ◽  
Dimethyl Formamide ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper
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