Platinum Nanoparticles Modified Copper/Titanium Electrodes as Electrocatalysts for Borohydride Oxidation

In this study, sodium borohydride oxidation has been investigated on the platinum nanoparticles modified copper/titanium catalysts (PtNPsCu/Ti), which were fabricated by employing the electroless copper plating and galvanic displacement technique. ICP-OES, XRD, FESEM, and EDX have been used to characterize PtNPsCu/Ti catalysts’ composition, structure, and surface morphology. The oxidation of sodium borohydride was examined on the PtNPsCu/Ti catalysts using cyclic voltammetry and chrono-techniques.

Low-Temperature Metallization and Laser Trimming Process for Microwave Dielectric Ceramic Filters

This paper describes a low-temperature metallization and laser trimming process for microwave dielectric ceramic filters. The ceramic was metalized by electroless copper plating at a temperature lower than those of conventional low-temperature co-fired ceramic (LTCC) and direct bond copper (DBC) methods. Compared with filters made via traditional silver paste sintering, the metal in the holes of the microwave dielectric filters is uniform, smooth, and does not cause clogging nor become detached. Further, the batches of fabricated filters do not require individual inspection, reducing energy, labor, cost, and time requirements. A microwave dielectric filter was then manufactured from the prepared ceramic using a laser trimming machine with a line width and position error within ±50 μm; this demonstrates a more accurately controlled line width than that offered by screen printing. After using HFSS software simulations for preliminary experiments, the microwave dielectric filter was tuned to a target Wi-Fi band of 5.15–5.33 GHz; the return loss was <−10 dB, and the insertion loss was >−3 dB. To implement the real-world process, the laser parameters were optimized. Laser trimming has a higher success rate than traditional manual trimming, and the microwave dielectric filter manufactured here verified the feasibility of this process.

Copper Electroless Metallization of Cellulose Paper via Polydopamine Coating and Silver Catalyst

The paper presents the results of copper electroless metallization of cellulose paper with the use of a polydopamine coating and silver catalyst. The polydopamine coating was deposited via a simple dip method using a dopamine hydrochloride solution in 10 mM TRIS-HCl buffer with a pH of 8.5. The research showed that as a result of this process, cellulose fibers were covered with a homogeneous layer of polydopamine. The unique properties of the polydopamine coating allowed the reduction of silver ions from silver nitrate solution and the deposition of silver atoms on the paper surface. Deposited silver served as a catalyst in the autocatalytic electroless copper-plating process. The copper layer covered the entire surface of the paper sheet after 5 min of metallization, favorably affecting the electrical properties of this material by lowering the surface resistivity. The deposited copper layer was further characterized by good adhesive strength and high susceptibility to deformation.

Characterization of MAO + Cu Composite Coatings on Aluminum Alloy

Novel composite coatings were fabricated on 6061 aluminum alloy substrates by two steps combining micro-arc oxidation (MAO) plus electroless copper plating (Cu). Different MAO + Cu composite coatings were compared. Cu continuously and evenly covered an aluminum oxide surface during processing thus changing the surface topography. The adhesion of MAO + Cu composite coating was tested by the pull-out method. The best adhesion strength of the composite coating can reach industrial requirements. The effects of the composite coatings on friction were investigated using a ball-on-disc test method. It is found that copper in composite coatings plays a lubricating effect during the wear process under dry sliding. Furthermore, the mechanisms by which the observed advantages were produced are discussed.

A Facile Method Combined with Acetic Acid Modification and Electroless Plating to Fabricate Copper-plated Nylon 12 Powder for Antistatic Coating

Metal particle could deposited on Nylon 12 (PA12) surface using electroless plating with excellent interface and distribution, but the use of noble metal as catalytic site would increase the process cost and restrict its application. In this work, we employed a facile technology combined with acetic acid etching and electroless copper plating to prepare Cu/PA12 composite powder, and it used as conductive filler for antistatic coating was also studied. Results manifested defects (hole and amorphous structure) and amide group established on etched PA12 surface, which would facilitate the destruction of the [Cu-EDTA] structure, and then the reduction of REDOX barrier. As a result, Cu and Cu2O particles deposited on its surface. The downward trend of volume resistivity of antistatic coating appeared the rule of slow-fast-slow. The lowest volume resistivity was about 105 ohm�cm. This means that the dependable technology has great potential application in preparing metal/polymer composite material at a low cost.