Role of additives in electroless copper plating using hypophosphite as reducing agent

2012 ◽  
Vol 206 (15) ◽  
pp. 3405-3409 ◽  
Author(s):  
Xueping Gan ◽  
Kechao Zhou ◽  
Wenbin Hu ◽  
Dou Zhang
Keyword(s):  
Reducing Agent ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless copper plating using FeII as a reducing agent

2004 ◽  
Vol 49 (2) ◽  
pp. 233-238 ◽  
Author(s):  
Michinari Sone ◽  
Koichi Kobayakawa ◽  
Makoto Saitou ◽  
Yuichi Sato
Keyword(s):  
Reducing Agent ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless copper plating using hypophosphite as reducing agent

1997 ◽  
Vol 95 (1) ◽  
pp. 34-37 ◽  
Author(s):  
D.H. Cheng ◽  
W.Y. Xu ◽  
Z.Y. Zhang ◽  
Z.H. Yiao
Keyword(s):  
Reducing Agent ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless copper plating on PET fabrics using hypophosphite as reducing agent

2007 ◽  
Vol 201 (16-17) ◽  
pp. 7018-7023 ◽  
Author(s):  
Xueping Gan ◽  
Yating Wu ◽  
Lei Liu ◽  
Bin Shen ◽  
Wenbin Hu
Keyword(s):  
Reducing Agent ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application

2004 ◽  
Vol 449-452 ◽  
pp. 393-396
Author(s):  
Dae Geun Kim ◽  
Jin Soo Bae ◽  
Jae Ho Lee ◽  
Yang Do Kim ◽  
Yoo Min Ahn
Keyword(s):  
Electrochemical Techniques ◽  
Deposition Process ◽  
Electrolyte Composition ◽  
Electrochemical Kinetics ◽  
Kinetics Study ◽  
Mixed Potential ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless copper plating was investigated for the electronics applications, such as a metallization for ULSI and MEMS etc. The role of electrolyte composition on the kinetics and mechanism of the electroless copper deposition process was described. Electrochemical techniques were employed for the investigations. The mixed potential and current were determined and then those were compared with experimental deposition rate. The kinetics is strongly influenced by the pretreatment and additive concentrations.

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