An advanced finite element strategy for thermal stress field investigation in aluminium interconnections during processing of very large scale integration multilevel structures

1999 ◽  
Vol 30 (12) ◽  
pp. 1207-1212 ◽  
Author(s):  
P.M. Igic ◽  
P.A. Mawby
Keyword(s):  
Finite Element ◽  
Thermal Stress ◽  
Stress Field ◽  
Large Scale ◽  
Field Investigation ◽  
Very Large Scale Integration ◽  
Thermal Stress Field ◽  
Large Scale Integration ◽  
Scale Integration

Behavior Models of Voltage Differencing Inverting Buffered Amplifier and Applications in Circuit Analysis

2019 ◽  
Vol 12 (4) ◽  
pp. 298-303
Author(s):  
YongAn LI
Keyword(s):  
Large Scale ◽  
Vlsi Design ◽  
Circuit Analysis ◽  
Second Order ◽  
Very Large Scale Integration ◽  
Behavioral Models ◽  
Order Filter ◽  
Large Scale Integration ◽  
Scale Integration ◽  
Behavior Models

Background: The symbolic nodal analysis acts as a pivotal part of the very large scale integration (VLSI) design. Methods: In this work, based on the terminal relations for the pathological elements and the voltage differencing inverting buffered amplifier (VDIBA), twelve alternative pathological models for the VDIBA are presented. Moreover, the proposed models are applied to the VDIBA-based second-order filter and oscillator so as to simplify the circuit analysis. Results: The result shows that the behavioral models for the VDIBA are systematic, effective and powerful in the symbolic nodal circuit analysis.</P>

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